Due to many requests the submission deadline for the proceedings has been set to September 30th 2023 (very hard deadline).
No extension will be considered.
An email will be sent to the corresponding authors of all accepted abstracts, containing individual login credentials for uploading your manuscript for publication in the International Conference on Silicon Carbide and Related Materials 2023 edition at our publications partner, Trans Tech Publications:
Username : individual number
Password : individual alpha-numeric password
After you log in, please select the « Author » role at the top of the screen to access menus and instructions for uploading your new or revised manuscripts.
When preparing your manuscript, please be sure to follow the template instructions below. Please fill in the manuscript Checklist (one of the entries on the Author bar). While submitting the manuscript, be sure also to add all the required information.
Important note: The above-mentioned email was sent only to the first authors. In case the submission process of your paper will be performed by another author, please contact us at email@example.com as soon as possible.
Manuscripts have to be prepared; camera ready with 4 pages or more (minimum 4 pages, upper page limit is 8) for both contributed and 6 pages or more (minimum 6 pages, upper page limit is 10) for invited papers. The content of manuscript must be based on the presentation at the conference.
The manuscript template for editing your manuscript in Overleaf (LaTeX) can be found here.
Please provide keywords. Do not use PACS numbers or general keywords such as “silicon carbide” or “gallium nitride”. Keywords are used to prepare the index.